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About JAEIN CIRCUIT Products Quality & Technology R&D Customer Support
Cutting
Facility Process mechanism Process features
Initial phase of PCB manufacturing to re-process according to sizes convenient for process of the plant in sheet type W/SIZE 412 * 520
CAPA 13,000m2 / month
Management allowance ± 2mm
Quality features Wrinkle, Printing, Scratch
   
   
   
 
Laminating (hot-press)
Facility Process mechanism Process features

Process to attach stacked-up finished products using high temperature and pressure. When working, it is important to setting work according to product sizes and material types.

CAPA 5,000m2 / month
W/SIZE 500*600
Temperature deviation ± 3℃
Quality features Resin flow, De-lamination
   
   
   
 
DRILL
Facility Process mechanism Process features

Process to form holes using bit on the products treated for part inspection or hole processing.

Process type Mechanical drill
CAPA 13,000m2 / month
Location ± /-0.125
W/SIZE 550*650
MIN/DRILL 0.15
Quality features Incomplete processing, hole-clogging, resin
   
 
 
D/F
Facility Process mechanism Process features
Process to attach base with D/Film using heating L/A Roll
Forming circuit by blocking exposure to light on the film and non-film surface of Master Film
W/SIZE min 550*680
CAPA 13,000m2 / month
Plate thickness max 6.3t
Resolution 75/75
Quality features Open, Short, Exposure inclination
   
   
 
D/E/S
Facility Process mechanism Process features
Developing: Process to melt D/Film part where the exposure is blocked
Corrosion: Process to corrode copper foil where D/Film is developed
Flaking: Process to remove D/Film polymerized after corrosion process
W/SIZE min 550*680
CAPA 10,000m2 / month
Plate thickness max 6.3t
E/FACTOR min 3
Etching 50/50
Quality features Open, Short, Slit
   
 
AOI check
Facility Process mechanism Process features
Process to check for abnormality by comparing products finished with circuit formation with data through optical method using high performance/ high magnification camera W/SIZE 700*700
Testing 50/50
Plate thickness 6.5t
Quality features Defect, pin hole, open, no developing
   
   
   
 
PSR
Facility Process mechanism Process features
Printing to protect circuit on the product surface and to prevent short circuit
Forming solder mask using UV light
W/SIZE 700*700
Resolution 70
Ink thickness 20 ± 5㎛
Plate thickness 0.2t~6.3
Quality features Skip, non-developing, inclination
   
   
 
Printing (Marking)
Facility Process mechanism Process features
Process for marking using silk screen
Marking of product direction, SMT part location, manufacturer, production information, etc.
W/SIZE 700*700
Plate thickness 0.2t~6.3
Printing allowance ± 100㎛
Printing 130
Quality features Inclination, smudging, omission
   
   
 
Surface treatment (Plate)
Facility Process mechanism Process features
Process of plating the copper surface on PSR open part
Plating methods including enig, osp, hal, tin, eletrolysis /gold, etc.
W/SIZE 500*600
Plate thickness 0.2t~6.3
Plating thickness Depending on plating methods
Quality features plating thickness, adhesion, discoloration
   
   
   
 
ROUTER
Facility Process mechanism Process features
Process to proceed exterior process of the product using bit to form the product exterior W/SIZE 500*650
Process type mechanical drill
Process error +/-0.2
MIN/DRILL 1
Quality features Non-processing, inclination, process defect
   
   
 
BBT check
Facility Process mechanism Process features
Process to check open, short in circuit using electric properties
Test on open, short using BBT fixture
W/SIZE 500*500
Plate thickness 0.2t~6.5
Testing 75/75
Effective resistance Open : 50Ω
Quality features Marking, mixed input, poor handling
   
   
 
Shipping inspection
Facility Process mechanism
• Sampling inspection before shipping on the products on which final inspection is complete
  ▶Managing Shipping report and reliability
 
Packaging, shipping
Facility Process mechanism
• Tray, rectangular case packaging for products on which shipping inspection is complete.
• Vacuum packaging for damp-proofing, and storing.